Used TORAY Inspectra-3000 FR 200 #9157738 for sale
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ID: 9157738
Wafer Size: 8"
Vintage: 2014
Surface monitoring system, 8"
2014 vintage.
TORAY Inspectra-3000 FR 200 is a mask and wafer inspection equipment designed for advanced semiconductor fabrication. It is designed to provide detailed analysis of masks, wafers and other substrate materials for non-destructive analysis of defects and process characteristics. The system is capable of detecting particle, line, area and thickness defects on various materials including photomasks. It supports a full range of defect types including line pitches, adverse developing patterns, particles and contaminants, and film defects. In addition, the unit has the ability to detect mechanical faults, surface defects, and open shorts with high resolution. Inspectra-3000 FR 200 has a high-sensitivity scanning machine with a resolution of 1.2 x 0.9 microns, and a field of view of 0.7 x 0.5mm. It has a variety of imaging options to meet inspection needs. The three-dimensional image composition allows users to acquire images of greater depths and spatial resolution. This makes it capable of detecting very small defects and of recognizing subtle differences in light, dark and grey areas of the sample. The tool has an automated alignment, focusing and edge detection feature, which improves accuracy and reduces setup time. The asset also has a simplified software and hardware architecture, which makes it easy to use and maintain. The software also allows for easy loading and analysis of samples, as well as data analysis and reporting. In addition, the model supports various imaging modes and analysis tools, such as dark field imaging, optical microscope, scanning electron microscope, fluorescence and pattern recognition. The equipment is equipped with an automated image acquisition and analysis algorithm, which automatically analyzes defects in wafers or photomasks. This speeds up the process and makes the system more reliable. In conclusion, TORAY Inspectra-3000 FR 200 is a powerful tool for efficient and accurate inspection of materials. Its automated features enable accurate analysis and detection of defects and process characteristics and its high resolution imaging capabilities provide users with detailed understanding of the characteristics of their samples.
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