Used ZEISS / ACCRETECH / TSK RONCOM 55A #9118660 for sale
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ID: 9118660
Vintage: 2002
Form tester
Measuring range:
Max. measuring diameter: 350mm
Left/right feed (R-axis): 191mm
Up/down feed (Z-axis): 350mm
Max. load diameter: 600mm
Max. measuring height: outer diameter 350mm (675mm for roundness/coaxiality measurement), inner diameter 350mm
Rotation accuracy:
JIS B7451: (0.02 + 6H/10000)um H: height from table surface to measuring point (mm)
Max. deviation from min. square circle: (0.01 + 3H/10000)um
Straightness accuracy:
Up/down direction (Z-axis): 0.15um/100mm, 0.3um/350mm
Radius direction (R-axis): 1um/100mm
Parallelness accuracy:
Up/down direction (Z-axis): 1.5um/350mm
Rotation speed:
Measurement: 2-10/min
Alignment: 6, 10 or 20/min
Up/down speed (Z-axis):
Measuring speed: 0.6-6.0mm
Movement speed: 0.6-30.0mm
Radius speed (R-axis)
Measuring speed: 0.6-6.0mm
Movement speed: 0.6-15mm
Auto stop:
Function: Z-axis, R-axis
Stop accuracy: Z-axis +/-5um, R-axis +/-5um
Table load conditions:
Table outer diameter: 290mm
Centering adjustment range: +/-5mm (automatic)
Tiling adjustment range: +/-1° (automatic)
Detector:
Measuring force: 30-100mN
Stylus shape: 1.6mm carbide ball
Roundness evaluation of profile error:
MZC (min. range center line method), LSC (min. square center line method), MIC (max. inscribed circle center line method)
MCC (min. circumscribed circle center line), N.C. (no correction)
Measuring items:
Rotation direction: roundness, flatness, parallelness, concentricity, coaxiality, cylindricity, diameter deviation, non-uniformity, squareness, run-out
Rectilinear direction (Z): straightness, taper, cylindricity, squareness, paralleness
Radius direction (R): straightness
Functions: CN measuring function, notch function (level, angle, cursor), parameter design value collation
Types of filters: digital (2RC, Gaussian)
Cut-off value:
Rotation direction: 15, 50, 150, 500, 15-150, 15-500 peaks/rotation
Rectilinear direction (Z): 0.025, 0.08, 0.25, 0.8, 2.5 or 8mm
Display:
Monitor: 15" Color
Content: measuring conditions, measuring parameters, profile drawing (expansion plan, 3D plan, shading), printer output conditions, comments, error message, etc.
Recording unit:
Method: select color printer or laser printer
Magnification: 10-200K (22 steps), auto, measuring magnification
Power source: AC 100V, 50/60Hz
Power consumption: 800VA (not including printer)
Air source: 0.5 - 0.7MPa
Air consumption: 30 l/min
(1) Reference sphere
(1) Reference cylinder
(2) Reference gauge blocks
Computer & monitor
Currently installed in cleanroom
2002 vintage.
ZEISS / ACCRETECH / TSK RONCOM 55A is a state-of-the-art mask and wafer inspection equipment designed for use in the semiconductor industry. The system offers excellent image resolution, high sensitivity and an Automated Defect Review Unit (ADRS). The basic machine consists of a motorized x/y stage, an automated wafer handler, a microscope head and a light source. The tool is capbable of both 1x and 10x inspections. The microscope head features a 10x infinity-corrected optical asset that yields excellent imaging performance with flat field of view in both brightfield and darkfield illumination. The light source is highly ligtetstable and features a 40 klux output capability. Along with a motorised filter wheel, this allows for application-specific inspection of defects such as scratches, particles, charge-traps, pattern-faults and more. The model also offers Automatic Defect Review Equipment (ADRS), an advanced AI-based machine-learning algorithm that allows for automated defect inspection with excellent reliability. The system's results can be exported to different formats for reporting and further analysis. TSK RONCOM 55A comes with comprehensive software functionality for wafer handling, inspection, review and analysis. Its user interface is intuitive and easy to use, making it ideal for a wide variety of defects inspections applications in the semiconductor industry. At the heart of the unit is the state-of-the-art motorized x/y stage which provides precise, repeatable movement during sample loading/unloading and during inspection. Combined with the automated wafer handler, this allows for the inspection of multiple wafers in one go while maintaining outstanding accuracy and repeatability between inspecting multiple wafers. Overall, ZEISS RONCOM 55A is an advanced machine designed for mask and wafer inspections in the semiconductor industry. It offers high image resolution, reliable automated defect inspections and easy-to-use software, making it an excellent choice for precise and efficient defect inspections.
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