Used ZYGO GPI XP #293810537 for sale

ZYGO GPI XP is a mask and wafer inspection equipment with superior imaging capabilities. It is designed to be used for defect review and characterization during production of semiconductor wafers. It can be used for multiple stages of process control and process optimization. The system has two main components: a two-axis scanning platform and a high-resolution image acquisition unit. The two-axis scanning platform is designed to provide rapid, accurate, repeatable, and reliable scanning of semiconductor wafers. Its multichannel design combines a range of imaging channels for increased flexibility and performance. The image acquisition machine consists of two charge-coupled device (CCD) image sensors, each with an area of 15mm x 15mm, enabling high-resolution imaging of semiconductor defects. The tool offers precise defect identification, positional accuracy, high-speed imaging, and dynamic imaging capabilities. It is designed to easily locate defective die, identify the size and shape of the defect, and automatically archive errant die images for off-line analysis. Additionally, the built-in automatic aligner allows for immediate location of defective sites without manual intervention. ZYGO GPIXP also includes a suite of powerful post-processing tools that can be programmed to optimize and sort defect signals to improve reporting accuracy and reliability. Furthermore, the asset incorporates a suite of valuable workflow management features for efficient defect analysis, including image storage and retrieval, job tracking, and data analysis and visualization. GPI-XP is a valuable tool for semiconductor production, providing advanced analysis to quickly identify and characterize defects. Its superior imaging capabilities, advanced defect detection capabilities, and powerful post-processing and workflow management features make it ideal for optimizing both process control and product quality.