Used SONOSCAN Gen5 #9254197 for sale

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Manufacturer
SONOSCAN
Model
Gen5
ID: 9254197
Vintage: 2010
C-Mode Scanning Acoustic Microscope (C-SAM) Single channel operation Side table Step down transformer Chamber SDX800 Square pixel scanner DAC282 Kinematic tank kit DAC346 Universal wafer stage and tank assembly DAC286A Waterfall transducer adapter with temperature controlled recirculating system for water SDX3500 Dual pulser DAC311A VRM DAC342C Turbo scan speed DAC328 Resolution: 16 K SDX123 FPW Dual, 23" Widescreen FP monitor DAC319 Certified resolution calibration standard sample DAC244W VHR Visual acoustics DAC228 QBAM DAC219 DIA DAC258 AIMM RF Channel DAC221 Step down transformer (115 volts) 230 V, 50 Hz PIO Configuration Operating system: Windows XP Frequency: 400 MHz CE Marked 2010 vintage.
SONOSCAN Gen5 by SONOSCAN is an inline acoustic scanning microscope designed for the inspection of wirebonded microelectronic packages. It enables high-resolution acoustic imaging of the interior of packages and their components as well as precise bond position and location measurements with minimal disruption to the underlying material structure. In comparison to the prior generation system, Gen5 has improved speed and resolution within a minimized profile. It offers higher sensitivity giving users the ability to clearly image and measure any type of wirebond and thin-film component. The integrated dual cameras also provide 3D and 2D imaging capabilities along with a stable field-of-view for ease of comparison between different images. The two cameras also enable automated inspection of connections and components without requiring manual alignment of the two cameras. SONOSCAN Gen5 utilizes a single transducer and an on-axis imaging head assembly. The transducer emits focused ultrasound pulses and the receivers measure the echo signals generated from the internal features of the package. These signals are processed by the on-board electronics and then stored in the memory. Because of its small size, Gen5 can easily fit into tight spaces and is suitable for high-accuracy non-destructive testing and imaging. The use of SONOSCAN Gen5 increases the reliability and validation of the bond qualilty with fully automatic imaging and analysis. Features such as the 3D filar display, the absence of an acoustic delay line, and high resolution correlation imaging provide a thoroughly detailed package inspection. Gen5 also includes an intuitive graphical user interface which allows users to customize their interface with ease making operation straightforward and simple. In conclusion, SONOSCAN Gen5 is a powerful tool designed for precise inspection of wirebonds, thin-film components, and microelectronic packages. With its improved speed and resolution as well as 3D and 2D imaging capabilities, Gen5 provides an accurate and dependable non-destructive test of the package. This makes it an ideal choice for any quality inspection or component validation task.
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