Used AMI / PRESCO 207 #190039 for sale
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ID: 190039
Orbital welder with closed orbital welding heads
Full water cooled package
Includes one head, additional heads available
Features:
Closed welding heads available are 9-3500, 9-4500, 8-4000 and 9-750 plus other sizes for fusion welding
Mains Supply 240 or 110 volts 50/60hz
100/150 amps. Operational Manuals in English
Up to 100 different welding schedules can be stored in its memory
Internal printer, external memory port for additional memory
Weight 36kg without cooling
Injection pulse start, pulse rate 0.05 to 50pps
Standard software prompts the operator in English, French, German, Norwegian, Swedish and Japanese
Pre-programmed/programmable power supply
Key switch locks out unauthorized personnel
Optional weld heads available:
8-4000
9-4500
9-750
9-3500
1994 vintage.
AMI / PRESCO 207 is a 'other wafer processing' equipment designed to provide high throughput and increased reliability for wafer sorting, dicing and inspection. The system is equipped with an extensive suite of features to handle the most challenging of wafer processing jobs. AMI 207 is based on a modular, single-cockpit operation design, allowing operators to quickly and accurately perform a variety of processes. It also provides an extensive suite of automatic process monitoring features, including automatic setup and rapid recovery following operator intervention. This unit is particularly well suited for dicing wafers for 3D integration, easily handling a variety of wafer sizes and shapes. The machine also offers an intuitive graphical interface, allowing operators to quickly enter commands from either touchscreen or keyboard. It also includes a unique vision tool that automates the sorting, measuring and inspection of wafers in an efficient manner. It is capable of sorting wafers to 0.05mm accuracy and automatically checks for thickness and shape irregularities. The asset also provides automated, repeatable operation and traceable history-of-use reporting for enhanced process control. It includes precise vacuum chucking and precise spindle control mechanisms for secure positioning of wafers before and during dicing operations. The model also includes a host of safety features, including automatic die protection, to protect operators from injury. PRESCO 207 is a powerful tool for wafer processing, quickly and accurately performing any wafer sorting, dicing or inspection functions. It offers enhanced operator safety and provides a simple graphical interface for fast entry and configuration of commands. Its powerful vision equipment offers automated wafer sorting, measuring and inspection with 0.05mm accuracy. Its precise vacuum chucking and spindle control mechanisms provide a secure positioning of wafers for dicing operations, while its history-of-use reporting and traceability offer enhanced process control.
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