Used AQUEOUS TECH ECO #9185902 for sale

AQUEOUS TECH ECO
ID: 9185902
Vintage: 2009
Stencil cleaner 2009 vintage.
AQUEOUS TECH ECO is a revolutionary new system for other wafer processing. This high throughput, low footprint equipment utilizes proprietary aqua-processing technology, and is capable of multi-stage processing across all types of wafers including Si, GaAs, InP, SoI and FDSOI. The system consists of four major components, the chlorine based pretreatment reactor, the ozone based fluorination reactor, the plasma based oxidation reactor, and the acid based post-processing tank. The chlorine based pretreatment reactor is used to remove contaminants and native oxide from the wafer surfaces. After pretreatment, oxygen and hydrogen based radicals are generated to enhance the adhesion of subsequent process steps. The ozone based fluorination reactor is then utilized to achieve high quality deposition of dielectric films on the wafers. The plasma based oxidation reactor is used to refine the surface quality of the wafer before it enters the acid based post-processing tank. The acid based post-processing is used to etch away the dielectric films. The etching process is carefully monitored to ensure that the surface of the wafer is uniform and free from defects. The tuned process parameters enable shallow and deep etching operations. Following post-processing, a conductive seed layer and a passivation layer are deposited on the wafer. Finally, the wafer is inspected and the surface is checked for any damage or defects. ECO is designed to ensure minimal waste and environmental impact. It uses environmentally-friendly solutions for the pretreatment, fluorination, oxidation and post-processing stages. Various fluids are also collected and reused to minimize waste and ensure optimum treatment of the wafers during processing. AQUEOUS TECH ECO is a reliable and cost effective system that can be used in a variety of industrial applications, including microelectronics, photonics, and biomedical devices. Its high aspect ratio etching capabilities and low footprint are particularly suitable for wafer-level packaging and MEMS/NEMS integration. With its flexible and user-friendly design, ECO is an ideal choice for wafer processing operations.
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