Used AQUEOUS TECH SMT800 #9242474 for sale

AQUEOUS TECH SMT800 is a equipment designed for advanced wafer processing. It comprises of an automated module for automated materials handling, wafer split handling, bonder control, laser dicing system, and wafer cleaning to automatically process wafer substrates up to 800mm in diameter. The module utilizes a Smart Process Computer Unit to monitor operation. The computer machine is set up with graphical user interface which displays operations, allows setting parameters and controlling machine. The materials handling process begins by loading a tray of raw materials into the machine. The tray can hold up to 200 wafers per batch. The wafers are then transferred to the main delivery station, which makes them available for processing. SMT800 is equipped with an automated bonder for attaching a desired patterned ring around each wafer. The bonder can be programmed to selectively bond only certain sections of the wafer with precision. Once the bonding process is complete, the machine moves the wafer to the laser dicing station. Here, a high-powered laser is used to cut small parts out of the wafer at high precision. This process is followed by a wafer cleaning process which removes any residue from the laser cutting. The cleaned wafers are returned to the tray for final inspection and then unloaded from the machine. AQUEOUS TECH SMT800 uses an advanced alignment tool to ensure accuracy and repeatability of the process. The asset is customized to meet the customer's specific requirements. Apart from the automated version, SMT800 can also be operated manually for long and complex applications. The model offers enhanced reliability and reduced cycle times, making it an ideal choice for a wide variety of wafer processing applications.