Used BARON BLAKESLEE MLR-480LE #138708 for sale

BARON BLAKESLEE MLR-480LE is an advanced wafer-processing equipment designed for both precision polishing and post-etch applications. This system offers all the necessary capabilities for wafer processing with high-performance, reliable data collection, and process monitoring. For polishing applications, MLR-480LE is equipped with a rotary motion-control spindle and precision servo positioners to ensure superior accuracy and repeatability in the processing. The unit also applies a combination of automated and manual polishing processes for higher efficiency and consistent, high-quality results. The machine's post-etch processing capabilities are designed for high-volume applications such as wafer-based devices and substrates. BARON BLAKESLEE MLR-480LE is equipped with fully automated pattern recognition, defect detection, and assessment tools which provide the user with real-time data and process control. The tool also provides uniform, consistent results with the aid of integrated temperature control, as well as variable polish pressure, speed, and direction settings. The automated defect detection feature allows operators to identify and remove defects quickly, providing precision results. MLR-480LE is equipped with a variety of features that make it user-friendly, such as easy-to-follow instructions and graphical user interfaces (GUI) for easy operation. The asset's onboard diagnostics model ensures reliable performance and continuous monitoring of the wafer-processing processes. For additional safety and data handling, BARON BLAKESLEE MLR-480LE also incorporates an onboard RFID reader and camera for data transfer and tracking of wafers. MLR-480LE is an exceptional wafer-processing equipment that offers superior accuracy and repeatability in processing, high-volume production capabilities, real-time process monitoring, and enhanced safety and data handling features. This system is ideal for both polishing and post-etch applications, and its features make it a reliable and efficient choice for the precision machining of a wide variety of wafer-base devices and substrates.