Used BRANSON 2510 #190378 for sale

BRANSON 2510 is a state-of-the-art wafer processing station designed to enable efficient and reliable wafer processing. It is a highly-versatile wafer processing equipment that is capable of performing a wide variety of wafer-related processing tasks. It has an integrated wafer processing capability that enables the user to select and execute multiple operations on single or multiple wafers, including wafer slicing, sawing and surface treatment. 2510 is equipped with an integrated touchscreen LCD display that allows for intuitive control of the process. It also comes with an advanced software package that enables control of the system and monitoring of wafer characteristics. The user can fine-tune the parameters of each individual step of the process, ensuring optimal results in the end. BRANSON 2510 also features a highly-accurate automated wafer slicing capability. This allows users to quickly and efficiently obtain slices from semiconductor wafers of any thickness or complexity. The unit also features an integrated laser generator, enabling the user to cut wafer slices with exceptional precision. A built-in camera allows for verification of wafer slicing, which ensures optimal slicing results. In addition, 2510 also features an advanced wafer sawing machine. This allows users to quickly and accurately cut wafers into the desired size and shape. The saw capacity ranges from 2 to 12 inches in diameter and features high-precision machined carbide inserts, ensuring a clean cut. A state-of-the-art cooling tool helps reduce the temperature of the sawing process, prolonging the life of the blades. Finally, BRANSON 2510 also offers an advanced surface treatment asset. This is designed to ensure that wafers are treated to a consistent and uniform finish. The model has adjustable wafer rotation speeds, as well as a wide array of spindles and brushes, enabling users to achieve an optimal finish for their wafers. In conclusion, 2510 is a comprehensive wafer processing equipment that enables users to efficiently and reliably prepare and finish wafers for a variety of applications. It offers a highly-flexible solution with an integrated touchscreen control system and sophisticated wafer slicing, sawing and surface treatment capabilities.