Used BRANSON 3300iw+ #9363490 for sale

BRANSON 3300iw+ Wafer Processing Equipment is a dynamic tool designed for advanced micromachining operations. Offering unmatched speed and accuracy, 3300iw+ is ideal for precise wafer processing applications across a broad range of industries. With its unique features and benefits, BRANSON 3300iw+ provides customers with maximum throughput, accuracy, and cost savings. 3300iw+ is a wafer processing system that utilizes an advanced mechanical platform with a dual-wafer floating spindle and digital servo control. This advanced spindle allows for precise removal of material from both sides of a wafer up to 5" in diameter with accuracy up to 2 microns. The rotation speed of the spindle also enables high-precision removal of fine details in wafer processing applications. BRANSON 3300iw+ unit features a standard processing speed of up to 100 revolutions per second (rpm). This translates to higher throughput and faster processing times. In addition, an optional high-speed spindle package can reach up to 400 rpm for optimal throughput. The high speed spindle can be optionally configured with a dedicated air bearing for minimal centrifugal force and improved process repeatability. The machine also features an integrated vision tool. This asset helps align and accurately adjust the wafer in relation to the focused ion beam source. This leads to improved accuracy and repeatability in wafer processing. Furthermore, the model is compatible with a broad range of masks and stampers, enabling the equipment to be configured for a variety of custom wafer processing jobs. 3300iw+ Wafer Processing System is the perfect solution for advanced micromachining operations. Its speed, accuracy, and flexibility make it ideal for various wafer processing applications. With its advanced mechanical platform and integrated vision unit, the machine provides superior precision and improved throughput.