Used BRANSON 5210 DTH #9373230 for sale

BRANSON 5210 DTH
ID: 9373230
Wafer Size: 12"
Ultrasonic cleaner, 12".
BRANSON 5210 DTH is a dual tone high frequency non-contact precision cleaning equipment. It uses a combination of high-frequency mechanical vibrations and ultrasonic energy to safely and effectively clean parts and components. 5210 DTH is widely used in many industries, including aerospace, medical, automotive, and other wafer processing, to remove adhesives, oils, and other contaminants from substrates and metallic surfaces. BRANSON 5210 DTH is optimized for a range of substrates and surfaces, including silicon, aluminum, and stainless steel. It also has the ability to be used on substrates with special characteristics such as non-conductivity and softness. The high-frequency cleaning process enables users to quickly and reliably remove dirt, flux, oxidation, and other contaminants from the substrate without damaging the substrate surface. 5210 DTH is equipped with advanced automated features to ensure high-quality and repeatable cleaning cycles. It has built-in sensors that detect the presence of liquid contaminants, signalling the cleaner to transition into an appropriate cleaning cycle. Additionally, the cleaning system has built-in diagnostics to allow for proper troubleshooting and maintenance of the unit. In order to ensure optimal cleaning results, users can adjust the machine parameters to fine-tune the cleaning cycle. This includes the power setting, cycle time, cleaning temperature, and sonic frequency. BRANSON special sonicator control enables them to control the intensity and frequency of ultrasonic waves, accurately targeting the contaminated area and reducing the possibility of surface damage. BRANSON 5210 DTH is a reliable and efficient cleaning solution for a variety of applications. Its user-friendly features and superior cleaning performance make it a popular choice among industries. It is an excellent choice for wafer processing and for other cleaning applications that require reliable cleansing without damaging the substrate material.
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