Used BRANSON B250R #9241063 for sale

BRANSON B250R is a robust and powerful Wafer Processing Equipment that is capable of handling wafers up to 8 inch diameter. This system efficiently processes wafers of various sizes and shapes to provide precision cleaning and material removal. It features an advanced Computer Numerical Control-based (CNC) platform that enables users to set up automated production processes for very reliable and fast wafer processing. The unit includes a dual-belt conveyor machine for accurately aligning and indexing wafers for optimized processing, and a patented Wafer Safety Tool (WSS) for extra peace of mind and safety during processing. It also has a variable speed ultrasonic generator for precise adjustment of energy levels, along with multiple customizable wash programs that enable users to select the most appropriate settings. This asset's automated main processing chamber is self-contained and houses several unique Sub Hi-Q components that consist of oval-shaped rotating horns and two linear horns. Dependent on the different processes, these components can be used for Directionally Controlled Cycle (DCC) of high-frequency vibration, which is viewed as a superior performance process for wafer cleaning. In addition, an innovative inverted cluster configuration of the Sub Hi-Q components provides a higher rate of material removal. B250R is also equipped with an advanced flat-bed conveyor model, capable of handling up to 30 wafers at a time, and able to securely transport wafer pieces to the pre-set target location. Additionally, this equipment is equipped with two spray boxes for swift and smooth drying of wafers after cleaning. Furthermore, for highly-precise operation and wafer treatment, this system has a special Flood Cooling feature, which allows rapid cooling of wafers after any cleaning or etching processes are completed. Overall, BRANSON B250R Wafer Processing Unit is the perfect industrial-grade solution for wafer manufacturers who need fast and reliable processing with precise results. The machine has the ability to process several wafers at once, with multiple customizable wash settings that allow for optimal performance. Its advanced CNC control and Sub Hi-Q material removal tool guarantee the highest quality of finished products, and its easy-to-use design ensures that it will be quickly up and running in any work space.