Used BRANSON B3200R-4 #170902 for sale

BRANSON B3200R-4 is a high power wafer processing equipment designed for wafer mounting, sawing, and back grinding applications. The system is capable of handling 200mm silicon or 6-inch quartz wafers. It offers high precision, high throughput and repeatable processes for applications needing in-process metrology, high throughput, and truing. The unit features a wafer handling machine with a carrier assembly, PVI (Pick and Vacuum Inspection) station, and two dedicated back grind stations. The 200mm carrier assembly is designed to perform reliable transport of the wafers and any other required process support material. The PVI station is a dual sided optical tool with an integrated laser profiler that ensures accurate placement and flatness of the wafers being processed on the asset. The back grind station includes an adjustable precision spindle and a unique concentric diamond grinding device that ensures uniformity and precision on different wafer thicknesses. B3200R-4 is capable of handling a variety of wafer types, including standard, step, PMF, and PRF. The model is fitted with a precision vacuum chucking equipment that securely holds the wafers, a powerful laser for sawing operations, and a depth control system to ensure precise depth of cut. The unit is configured for single pass, dual pass, and multiple pass operations, and offers timely, repeatable, and accurate machining. The machine is equipped with a 24V DC motor for fine pitch and high accuracy control. This tool also offers process control capabilities such as CNC, teach-in, profile programming, and multiple spindle control, allowing high-speed, high-precision machining on a wide range of materials. BRANSON B3200R-4 is a highly advanced wafer processing asset designed for demanding applications and features design features that ensure efficiency, repeatability, and accuracy. It is an ideal choice for wafer fabrication process requirements.