Used BRANSON / IPC 250 U/S #9195060 for sale

IPC 250 U/S Wafer Processing Equipment is a wafer processing system designed for 25 mm wafers at 200 wafers per hour. This unit is capable of post etch/clean processing and is perfect for a variety of high accuracy wafer applications. It has a low-force contact handling machine which is designed to reduce damage to the edges of fragile wafers. The tool provides very high uniformity of etch and clean process, even across large batches due to its continuous process wafer transport. This wafer processing asset has many advantages. The wafer contact handling model has a very low contact force as well as minimal wafer visible shift, both of which are important features for wafers that are fragile or have intricate structures. The main feature of this equipment is its ability to deliver uniformity and repeatability in etching and cleaning operations. This means that the same process conditions can be safely used and each wafer will receive identical post-etch/clean processes every time. The substrate carrier present in the system also adds more benefits. Its 3-point wafer contact mechanism is designed to ensure exact repeatability in positioning and minimum processing wear. The wafer is uniformly supported by three points on each wafer edge, thus the wafer won't buckle or deform due to local heating during the process cycles. BRANSON 250 U/S Wafer Processing Unit has an integrated machine design with a high-tech control tool. This allows full process control from beginning to end and will enable operators to monitor processes as well as deliver traceability. It also has an optional cleaning module, which allows for an integrated post etch/clean process. This asset also comes with a variety of accessories that makes customizing or upgrading the model easy. The accessories include a wafer transport module to allow wafers to be returned back to their designated stations properties and a stainless steel enclosure for housing the equipment to minimize contamination and protect the system from damage, and additional modules for integrated post etch/clean processes. To summarize, BRANSON / IPC 250 U/S Wafer Processing Unit is designed to meet the demands of wafer processing and deliver the highest accuracy and repeatability. The low-force contact handling machine ensures minimal wafer damage and the optional cleaning module adds an integrated post etch/clean process. This tool is a great choice for a variety of high accuracy wafer applications.