Used BRANSON / IPC B 210 #9187148 for sale

BRANSON / IPC B 210 is an automated, precision wafer processing equipment that is designed for producing high-quality and defect-free semiconductor and glass materials. This system uses advanced technologies, such as ultrasound, laser, and wet etching, to create complex surface topographies and circuitry on chip and wafer substrates. It is a dual-stage unit with a pre-processing chamber and a post-processing chamber. The pre-processing chamber provides a controlled environment to prepare the substrates for processing. It has two main chambers - a thermal chamber and a wet processing chamber. The thermal chamber has a heating plate to condition and preheat the substrates for various thermal processes, such as oxidation, annealing, and diffusion. The wet processing chamber is equipped with several nozzles that can deliver an oxygenated etching solution, such as HF acid, copper etching solution, or hydrochloric acid, to clean and etch the substrates. The post-processing chamber is where the actual processing takes place. It has multiple tools and devices to apply layers of different materials on the substrate. The main tool is a UV laser microprobe, which is used to remove material from the substrate and create fine surface features. It is also used to sculpt and engrave patterns on the substrate. The post-processing chamber also has a piezoelectric printer, which is used to deposit various dielectric and conductor materials onto the substrates at specific locations. Additionally, a die attach dispense tool is included to place electronic components onto the substrate. IPC B 210 machine is also equipped with an advanced vision tool, which enables the machine to identify defects and contaminants on the substrate surface automatically. This asset also has a multi-channel gas control model, which provides precise flow control of toxic gases such as acetone and HF acid. The equipment has a large LCD touchscreen monitor, which provides real-time operating data about the wafer processing procedure and allows the user to control the process parameters. Overall, BRANSON B 210 is a highly advanced and sophisticated wafer processing system that can be used to create precise sub-micron level features. It is designed to provide the highest precision and quality, while also ensuring safety during the entire process. This unit is suitable for a wide range of applications, from making LEDs to producing microchips.