Used COBRA YCL-2110 #293643806 for sale

COBRA YCL-2110 is an advanced wafer processing equipment designed for precision cutting and sawing of a range of materials. This system has a cutting and sawing area of 290mm in diameter and a work area of 845mm x 540mm. All alignment functions are automatically performed, as well as high-speed laser alignment. The saw blade undergoes an adjustment in accordance with the exact cutting and sawing dimensions. YCL-2110 is equipped with an advanced vision unit for real time monitoring of wafer material selection and disruption of imperfections before production begins. This machine is managed by a user-friendly graphical user interface and the ability to track operations parameters and quality control. The software implements a self-optimizing algorithm which ensures accurate orientation and stability of the saw blade, while enabling high-speed cutting and sawing performance with high precision. The efficient COBRA YCL-2110 is capable of cutting and sawing a range of materials, including 8" up to 25.4" diameter, and thicknesses up to 12mm. This advanced tool is designed to provide a smooth and consistent operation for sturdiness and high-quality performance. Its cutting/sawing capacity can reach up to 100,000 wafer pieces per hour with a low level of vibration, so producing high-quality products at short cycle times is guaranteed. YCL-2110 includes features like a multi-level safety asset with dual alarms, optimizing and controlling of blade sharpening, and the integration of additional external components. The model includes explosion and dust proof covers, allowing it to be used safely in indoor or outdoor applications. The equipment also has IP66-rated protection, offering a air-tight enclosure to protect the machine from external contaminants. In conclusion, COBRA YCL-2110 is a high performance wafer processing system designed for efficient and accurate cutting and sawing of a variety of materials. This unit has an advanced vision machine, an user friendly graphical user interface, and an efficient self-optimizing cutter blade alignment algorithm, which allows it to operate at high speeds without sacrificing accuracy and precision. Furthermore, this tool has multiple safety features and IP66-rated protection, ensuring maximum reliability and durability. YCL-2110 is the ideal solution for meeting the needs of modern wafer processing applications.