Used COMCO MicroBlaster MB02-3C #9095720 for sale

COMCO MicroBlaster MB02-3C is a unique wafer processing equipment that utilizes high-capability plasma cleaning and etching technology. This system is designed with an aim to enhance surface cleanliness and improve etch rates on a variety of wafer materials including silicon, sapphire, and silicon oxide. It has three-dimensional movement and plasma striation capability. The built-in 3D scanner and the option of indexing provide a greater flexibility and accuracy to the user. MicroBlaster MB02-3C has a compact and efficient design that makes it one of the most advanced wafer processing systems available. This unit is equipped with a durable low-profile stainless steel frame and is capable of handling up to 200mm wafers. The MicroBlaster has a powerful radio-frequency (RF) generator that produces up to 200 watts of direct-current (DC) and 500 watts of RF power for quick and clean etching. COMCO MicroBlaster MB02-3C comes with an advanced software suite for easy and efficient control of the machine's activities. The software includes an advanced graphical user interface (GUI), real-time recipe automation, self-diagnostics, and temperature monitoring settings, enabling users to program, monitor, and manage several wafer processes. The MicroBlaster is capable of handling both etching and cleaning operations. The etching process uses dry, oxygen-containing atmospheres while the cleaning process uses ambient and ultra-dry process gases to remove any surface contaminants. The tool also features in-situ pre-etch and post-clean monitoring to accurately measure the degree of cleanliness and to ensure high-quality etching results. MicroBlaster MB02-3C come loaded with comprehensive safety features to protect the asset and personnel. These features include software-based override pre-programmed sequence settings to avoid potential hazards, a secondary RF generator to maintain plasma stability, and a plasma-closure mechanism for personnel safety. Additionally, the fully enclosed chassis and built-in cooling model provides protection against plasma overload. In conclusion, COMCO MicroBlaster MB02-3C is an ultra-advanced wafer processing equipment that offers a unique combination of precision and safety in a compact design. This system will allow users to quickly and accurately etch and clean a variety of wafer materials, reaching every area of the surface with clean and uniform results.