Used CREST Ultrasonic #9042962 for sale

CREST Ultrasonic is a wafer processing equipment that utilizes sound waves of high frequency to physically remove material from the surface of semiconductor wafers. The system is based on a concept called "active energy". This is the application of a mechanical force that causes a physical material removal from the surface of the wafers. By using continuously high frequency sound waves, the unit is capable of removing materials in a controlled manner. The machine further provides a high tolerable material removal rate for the materials used in wafer processing. Ultrasonic tool delivers precision in its material removal process. This is possible thanks to its ability to deliver precise pulse length of the sound waves. This helps to ensure that the process is reliable and exact. The asset further offers a way to achieve precise depths of material removal, allowing it to create different levels of surface finish. The non-contact nature of this model makes it a safe and efficient way to remove material from wafers without overheating them, or damaging the wafer during the process. The sound waves of CREST Ultrasonic is generated using user selectable frequencies and amplitude. This helps to deliver uniformity of the material removal process. The process further provides a fast, repeatable and precise material removal process for wafers for a wide range of materials used in them. Ultrasonic equipment works when the Wafer is placed upside down on the chuck and submerged in the cleaning bath. A heavy duty transducer is used to generate the sound waves at a frequency of 20-80 KHz and amplitudes up to 30.000µm. The sound waves created by the transducer travel through the cleaning liquid, which act as a lense and focuses the energy onto the wafer surface. This energy causes a local dislocation of the material at the surface of the wafer and creates mechanically induced dislocations in the material. This removes the material on the surface and brings the wafer back to its original state. The material removal process of CREST Ultrasonic is further controlled through sophisticated software algorithms. This helps to ensure that the process is controlled, uniform and precise. The system further offers an automated material removal process for wafers as it is capable of adapting to the changing material and environment conditions. Ultrasonic unit is suitable for use in multiple industries, from material removal for surface finish processes in the semiconductor industry to coating removal for polishing applications in the aerospace, biomedical and automotive industries. This machine offers precise material removal with a wide spectrum of use cases, offering a range of precise and precise finish processing for a variety of materials.