Used DAIWA D0L-2810 #293643822 for sale

DAIWA D0L-2810 is a state-of-the-art wafer processing equipment designed to provide high quality production rates and precision. The system allows for quick and efficient operation of both manual and automatic processes. The core of the unit is a high performance control platform capable of supporting all types of wafer tasks including thinning, etching, wet and dry cleaning, assembly, and more. The machine is equipped with an automatic thickness measurement module and an inspection module with software for easy data collection and analysis. D0L-2810 features a variety of modular arms and attachments for processing wafers of various sizes, shapes and materials. The tool provides precise control of the robotic arm under varying production conditions with high accuracy. It also offers obstacle avoidance, safety shutdowns, and targeted cleaning with the use of specialized brushes and nozzles. The asset is powered by a 5 kW AC-DC power supply and up to four high resolution cameras for the observation of the process. It features four independent grinding heads, three of which are equipped with HSS-SDC grinding plates and one with an electro-polishing plate. Additionally, it includes manual and automatic loading and unloading systems, an oxygen atomizer, and an optical emission spectroscopy model. The main frame of DAIWA D0L-2810 is made of anodized aluminum and stainless steel, with a hardened steel body and multi-layer insulation. It is engineered to provide stable operation and produce accurate results in a wide range of environments. The full equipment can be managed and operated by a single user. D0L-2810 is an excellent choice for a wide range of wafer processing applications. Its precision and quick operation make it an ideal choice for companies looking to reduce lead time and production costs, while maintaining a high quality final product. Its automated features, coupled with its excellent features, handle any wafer processing challenge with ease.