Used DAN-TAKUMA TECHNOLOGIES (Other Wafer Processing) for sale

DAN-TAKUMA TECHNOLOGIES is a leading manufacturer of wafer processing equipment that offers a range of innovative products for the semiconductor industry. In addition to their popular ODC-1402BEW model, they also provide various other wafer processing systems that cater to different needs and requirements. One notable product is the ODC-500RB, an advanced wet wafer cleaning system that utilizes a combination of chemical and megasonic technologies to provide superior cleaning performance. This system is designed to remove various contaminants, such as particles, organic substances, and metal ions, from the wafer surface, ensuring high-quality results. Another wafer processing system offered by DAN-TAKUMA TECHNOLOGIES is the ODC-200MB, which is a precision bonding system. This model utilizes an innovative adhesive bonding technology that enables precise and reliable bonding of wafers, chips, and other components. It offers excellent alignment accuracy, high bonding strength, and can handle various sizes and types of substrates. One more example is the ODC-500LL, a laser lift-off system. This system is designed for the separation of a thin film or device from a substrate using laser energy. It is widely used in the fabrication of compound semiconductor devices, flexible display panels, and microelectromechanical units. The ODC-500LL provides fast and efficient lift-off processes, ensuring minimal thermal damage to the substrate and high productivity. Overall, DAN-TAKUMA TECHNOLOGIES' wafer processing machines offer many advantages, including advanced technology, precision, reliability, and versatility. These tools are designed to meet the evolving needs of the semiconductor industry and provide high-quality results in various applications.