Used DSC GROUP DSC 104 #9395307 for sale

ID: 9395307
Ultrasonic cleaner Size: 41 x 48 cm.
DSC GROUP DSC 104 is a "Other Wafer Processing" equipment which has been designed to provide wafer processing support for the manufacturing of integrated circuits. It is a versatile system which is used for epitaxial layer deposition, chemical-mechanical polishing (CMP) of the wafer surface and for other related applications. It can also be used for device burn-in, micropatterning, optical inspections and chip testing. DSC 104 is equipped with a series of components which enable it to perform a wide range of wafer processes. Firstly, the unit contains a high-vacuum chamber, as well as a helium-powered ion source and electrons gun, which allow the machine to deposit thin layers of epitaxial material on the surface of the wafer. Secondly, the tool is equipped with a chemical-mechanical polishing (CMP) head, where the substrate can be wet- or dry- polished. This is a key step in the manufacturing process, as it enables the wafer surface to be accurately levelled out. In addition to the above, the asset also contains several other components such as a semi-automated wafer processing station, as well as multiple inspection stations (including microscope, image sensors and laser scan systems). Each of these components are integrated into a modular model architecture, allowing for an easy and efficient transfer of data and information between the various modules. DSC GROUP DSC 104 also includes various process control and feedback systems, allowing for tight control of the wafer deposition and polishing stages of the process. This is achieved through the use of multiple sensors, such as pressure and temperature sensors, as well as a frequency inverter which is used to provide precise control over the ion beam current. The frequency inverter is also used to regulate and monitor other process parameters, such as the rate of material deposition. Overall, DSC 104 is a versatile equipment which can be used for a variety of wafer processing operations. It is designed with tight process control and feedback systems, as well as multiple inspection modules and wafer processing stations, making it an ideal solution for production environments. The system's modular design makes it easy to upgrade and customize, making it suitable for a variety of needs within the electronics manufacturing industry.
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