Used EMC Spirit 30 IPA #9229741 for sale

EMC Spirit 30 IPA
ID: 9229741
Vintage: 1995
Stencil cleaner 1995 vintage.
EMC Spirit 30 IPA (Inline Processing Application) is a highly flexible and agile production automation equipment designed for semiconductor and microelectronic manufacturing. The system's modular design allows for easy integration into existing semiconductor technology platforms. The unit is comprised of multiple components including a robot controller, an automatic wafer transport machine, and a high-precision wafer processing unit. The robot controller is driven by an integrated PC that is programmed with multiple control algorithms. This controller can accurately and reliably synchronize and control the entire wafer transport tool, allowing for an efficient and precise internal process. At the core of the robot controller is the robot logic software which enables complex wafer handling operations and can be customized by the operator to achieve desired process results. The wafer transport asset is designed to move wafers from one step of processing to the next in a highly reliable and fast manner. This model is steered by a series of pre-programmed sequences and monitors the travel paths in order to ensure delivery to its destination. The equipment is built using a combination of PVC rods, mounted ball transfers, and linear actuators that work in tandem to ensure that wafers make it from their origin to their destination safely and efficiently. The processing unit is where the actual target wafer is processed. This unit is composed of a vacuum chuck, as well as a series of process chambers. The "optics" chamber is responsible for securely gripping and transferring the wafer up to the target wafer for processing. The sheet feeders within the "feeder" chamber allow for multiple wafer transfers to be completed simultaneously. The "process" chamber contains multiple physical and chemical processes that etch and deposit material onto the wafer as it is processed. Spirit 30 IPA is designed to deliver coupling, slicing, dicing, and other delicate microelectronic processes. The system's multiple tools, mechanical transportation, and high-precision processing capabilities make it an ideal choice for any semiconductor or microelectronic manufacturer. Its capacity for processing a wide array of target wafers and methods of production allow it to be easily integrated into existing production lines.
There are no reviews yet