Used ERNST PF 3300 #293650933 for sale

ERNST PF 3300 is a wafer processing equipment that is capable of precision fabrication and handling of high-temperature silicon wafers. This system is designed to enable the deposition and etching of many different materials on silicon wafers. It is specifically designed to provide a high degree of accuracy, control, and repeatability when executing processes such as wafer thinning, backside lapping, wet chemical etching, and even oxidation. The unit's capability in handling multiple substrates include silicon, germanium, quartz, GaAs and sapphire. The sizes of the wafers range from 50 mm to 300 mm and this machine can process a total of eight wafers at once. PF 3300 is designed with a robotic arm that is capable of precise and reliable handling of substrate wafers allowing for optimal etching and deposition of materials. The tool also features an inert environment, allowing for the precise deposition and etching of ultra-thin films. ERNST PF 3300's wafer etching chamber is filled with an inert gas such as Nitrogen or Helium, and it is designed to facilitate a precise etching of materials at precise temperatures. The chamber is also equipped with a temperature control asset important for ultra-thin film processing. The chamber is temperature-controlled to prevent any oxidation of the wafers during the etching process. The model is also capable of precision backside lapping of wafers with its included diamond lap, which allows for precise removal of excess material from the wafer's backside. The diamond lap is housed in the wafer holder to prevent any vibration or jolts that could affect the lapping process. PF 3300 is a powerful equipment designed for the specific handling of high temperature silicon wafers. With its robust, computer-controlled machinery, this system is capable of precise and reliable processing of various materials with minutes. The unit is equipped with an inert environment and diamond lapping which adds to its versatility, allowing the user to tailor the operation according to specific process requirements.