Used EVERFINE PLUS 150 #9215487 for sale

EVERFINE PLUS 150 is a state-of-the-art wafer processing equipment, designed to produce high-quality, uniform wafers with minimal flaws and debris. This system utilizes advanced technology for wafer production, such as precision automated fixturing and tooling to assure precise, repeatable operation. PLUS 150 also features a high-tech in-situ monitoring unit, which tracks the process parameters in real-time in order to avoid issues caused by improper operation or material conditions. EVERFINE PLUS 150 utilizes a custom wafer handling machine, which is designed to process 8-inch diameter wafer diameters with a thickness range of 0.1-1.5mm. The tool features a two-stage thermo-mechanical process, which includes a multi-zone pre-heat segment and a programmed temperature ramp-up. This process enables the asset to obtain a stable planarity of the wafer surface during the wafer processing sequence. Additionally, PLUS 150 has an optical lay-out, which is used to ensure proper laser alignment and minimizes stress forces induced into the wafer material. EVERFINE PLUS 150 is also equipped with an in-situ monitoring model that actively monitors the process parameters in real-time and uses data fusion and pattern recognition tools to rapidly detect any unexpected events or process deviations. This equipment sends notifications via text message and/or email to the operator and/or pre-determined personnel in the event of an exception, allowing for rapid response and corrective actions to be taken. The system also features a high-precision cleaning unit, which employs a combination of ultra-soft brushing, vacuuming, and various other cleaning technologies to ensure that no foreign particles and defect-inducing material remain on the wafers. The cleaning systems on PLUS 150 are capable of cleaning wafers up to 0.3 microns, and are also effective at removing typical "under-bake" particles and residues. In summary, EVERFINE PLUS 150 is a powerful, versatile wafer processing machine that has been engineered to provide rapid and accurate processing of a variety of wafer sizes and thicknesses with minimal flaws and debris. The tool utilizes advanced automated equipment and in-situ monitoring systems to assure precise, repeatable operation and minimize process errors, all while providing a high-precision cleaning asset to ensure a clean wafer surface for subsequent processing.