Used EXONE 160Pro #293815193 for sale
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ID: 293815193
Vintage: 2021
Industrial binder jetting metal 3D Printer
Building volume: 800 x 500 x 400 mm (XYZ)
Materials: 316L Stainless steel, 17-4PH Stainless steel, M2 Tool steel, 925 Ag sterling silver
DELFIN Industrial dust collector
Cables
Dust collector
Set of printheads
Powder handing station
Running hours: ~ 800
2021 vintage.
EXONE 160Pro is a cutting-edge other wafer processing equipment designed to meet the demanding requirements of advanced semiconductor fabrication and related industries. This state-of-the-art tool offers a comprehensive solution for wafer processing, including etching, deposition, cleaning, and other critical processes essential for the production of high-performance electronic devices. At the heart of 160Pro system lies its advanced process chambers, which are equipped with a range of innovative technologies to ensure precise and uniform processing of wafers. These chambers are designed to accommodate a variety of wafer sizes, ranging from small-scale research substrates to large production wafers, making the unit versatile and suitable for various applications. One of the key features of EXONE 160Pro machine is its sophisticated plasma etching capabilities. Utilizing a combination of reactive gases and plasma excitation, the tool can precisely remove material from the wafer surface with exceptional selectivity and uniformity. This enables the precise patterning of advanced semiconductor devices with high aspect ratios and sub-micron feature sizes, crucial for the production of cutting-edge integrated circuits and MEMS devices. In addition to etching, 160Pro asset also offers advanced deposition capabilities for depositing thin films of various materials onto the wafer surface. Whether it be dielectric layers, metal films, or other functional coatings, the model can achieve precise control over film thickness, composition, and uniformity, ensuring the high-quality and reliability of the fabricated devices. To maintain the cleanliness and integrity of the wafer surface, EXONE 160Pro equipment is equipped with advanced cleaning modules that utilize a combination of physical and chemical processes to remove residues and contaminants from the wafer surface. This ensures that the processed wafers meet the stringent cleanliness requirements of semiconductor fabrication and that the fabricated devices exhibit optimal performance and reliability. 160Pro system is equipped with a user-friendly interface and advanced software control capabilities, allowing operators to easily program and monitor the processing parameters in real-time. With a comprehensive set of diagnostic and monitoring tools, the unit enables operators to optimize process performance, troubleshoot issues, and ensure the reproducibility of results for high-volume manufacturing. Moreover, EXONE 160Pro machine is designed with flexibility and scalability in mind, allowing for easy integration into existing process lines and compatibility with future upgrades and expansions. Whether it be in research and development environments, pilot production lines, or high-volume manufacturing facilities, the tool can adapt to diverse application requirements and production demands. In conclusion, 160Pro asset represents a cutting-edge solution for other wafer processing applications, offering advanced plasma etching, deposition, and cleaning capabilities essential for the production of state-of-the-art semiconductor devices. With its versatility, precision, and reliability, the model is poised to drive innovation and enable the realization of next-generation electronic technologies in the semiconductor industry.
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