Used GREATSENSE GS-AIR-30 #293670976 for sale

GREATSENSE GS-AIR-30 is an advanced plasma-based wafer processing equipment designed for a wide range of applications. Its unique design features a high-vacuum chamber coupled with a unique inductively-coupled radio-frequency (RF) source module as well as an advanced electron cyclotron resonance (ECR) source for integrating different etch/deposition processes in a single platform. The system provides a high-quality processing solution for semiconductor and MEMS technologies. GS-AIR-30 unit is capable of providing high speed, low-temperature (<300°C) processing with a large dynamic range of plasma parameters with a single radio frequency (RF) source. It has excellent substrate temperature uniformity and high processing uniformity across a wide variety of substrates with a long source-platen lifetime. This allows users to achieve better yields for more complex 3D applications. The high-vacuum chamber is designed for easy cleaning and maintenance and is capable of processing substrates, such as silicon wafers, up to a maximum size of 300 mm in diameter. The process gases can be controlled with bipolar or single frequency RF and subsequently diffused in the chamber using ECR waves. The RF source can generate a wide range of RF frequencies, ranging from low frequency (50 kHz) to high frequency (10 MHz). The machine can support single and multi-chamber operation and offers several chamber options to meet specific customer needs. The tool control software provides several features to ensure user-friendly operation, including automatic wafer transfer, automatic wafer loading/unloading, temperature control, backside cooling, and wafer-by-wafer process monitoring. The asset also includes an optional RF shield as well as patented ECR monitoring software for further monitoring plasma parameters during film deposition and etching process. GREATSENSE GS-AIR-30 is certified by the most leading international safety standards, including NFPA-70E (Nationally Recognized Testing Laboratory (NRTL)), ANSI/UL-1300 (Underwriters Laboratories Inc.), and other standards. It can be used for a range of processes including: dry etching, stripping, plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), sputtering, and ion-implanted substrates. This wide range of applications and its high level of automation make GS-AIR-30 an advanced and cost-effective solution for various applications in the semiconductor and MEMS industries.