Used GREATSENSE GS-AIR-7 #293670957 for sale
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ID: 293670957
System
Capacity:
Down line and space: 7 µm
Copper thickness/space: ≤ 1.6
Materials:
Substrates: FR4, FR5, BT, PI, ABF
Thickness of substrate: 20 µm
Thickness of copper: 0-50 µm
Efficiency:
Copper thickness: 18 µm
Defect size: 40 x 10 µm²
Time: 30 sec
Connectivity:
ORBOTECH
CIMS
Machvision
YMZ AOI
GREATSENSE AVI
Informational functions:
QR Code reading functions
Reports
MES
Defect maps / Heat maps
Board size: 760x680 mm²
Board thickness: 50-10000 µm
Penetration to laminate: ≤5 µm
Deviation from normal line width: ≤ ±10%
Re-inspection magnification: 25X-400X
Available with customer-specific automation functions
Power supply: 220 V, 4.5 kW.
GREATSENSE GS-AIR-7 is a wafer processing equipment designed for a range of industrial applications. It employs an Atmospheric Plasma Processing (APP) technology to achieve a high degree of wafer surface preparation and cleaning. This system offers a unique combination of tunable plasma parameters, making it a preferred tool among users. GS-AIR-7 has an automated commissioning cycle which makes the setting up of the unit and adjustment of various parameters easy and quick. The machine is equipped with a robust industrial-grade vacuum chamber with advanced plasma-processing components that provide a safe and efficient environment for processing. GREATSENSE GS-AIR-7 has one independent RF power supply output, allowing the user to adjust the plasma parameters for extended power ranges. It also comes with a touchscreen interface that allows the user to control the tool in real-time. The asset can be used for various applications, including implant activation, metal oxide deposition, surface ashing, surface modification, and cleaning. On the whole, GS-AIR-7 offers a comprehensive set of features such as adjustable plasma parameters, computer-controlled end-point detection, error reports, alert messaging, and automated commissioning for an intuitive and efficient wafer processing experience. GREATSENSE GS-AIR-7 model has been designed for durability and long lifespan, and it contains all necessary components for reliable and powerful plasma processing. It utilizes a vacuum-tight chamber that provides an inert atmosphere for processing that helps reduce contamination and maximize the lifetime of the generated plasma. The integrated vector network analyzer helps the user precisely measure the amplitude and phase characteristics of the emitted plasma. The equipment also offers a high degree of flexibility in terms of the choice of plasma sources, making it adaptable to a variety of applications. The default version of the system is equipped with a two-point vector network analyzer to measure the generated plasma parameters in both linear and non-linear regimes. In addition, an optional advanced plasma source can be added to the unit to achieve higher precision and precision cleaning. GS-AIR-7 supports a variety of processes, including Ion implantation, ablation, aqueous cleaning, hydration, etching, annealing, precipitation, and atomic layer deposition. Similarly, the fan control option allows the user to optimize the process parameters for different target substrates. Furthermore, the machine is equipped with a wafer mapping feature that assesses wafer topography and makes the tool suitable for a variety of process applications. All in all, GREATSENSE GS-AIR-7 is an efficient wafer processing asset that provides excellent performance and high processing speeds.
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