Used HEISE C #9008204 for sale

HEISE C is an automated wafer processing equipment created by HEISE Corporation. The system has been designed to provide high precision processing with a low cost of ownership. The unit is able to process wafers up to twelve inches in diameter. It is highly accurate and precise, capable of achieving repeatable 3 micron feature size. It is suitable for processes such as fine pattern etching and precision microelectronic device fabrication. C is a compact and transportable machine that features a low profile, allowing for easy integration and implementation in existing production line environments with a minimum of disruption. It has a rugged, anodized aluminum upper housing and a corrosion-resistant housing for the top surface. At the core of the tool is a high-precision, dual-axis rotary positioning table. This allows for consistent and accurate rotation and alignment of the wafer. The table is driven by a low-noise, high-torque brushless servo motor. The asset also includes two independent lower-level processing steps. The first of these is a wet-etch processing station. This allows for an accurate and repeatable alkaline-based etching process. It is also capable of performing dry-etch processes using reactive ions. The second processing step is a passivation layer application station. This station is capable of applying high-performance, low-temperature-resistant protective silicon thin films and networks. HEISE C also includes a number of peripheral features and options such as a protective cover for the exposed wafer surfaces, an optimized substrates and process fluids management model, and a closed-loop process control equipment. In conclusion, C offers a high level of performance and precision in a compact and cost-effective package. It is designed for both research and production applications, and is an ideal solution for today's growing demand for wafer processing devices.