Used HEKEDA TY 250 #9301003 for sale

HEKEDA TY 250 is a high-performance wafer processing equipment designed for metallization processes in semiconductor device manufacturing. It is a stand-alone system that features a fully integrated platform with a plasma processing chamber, an in-situ wafer cleaning station, a cleanroom compatible transport/in-process wafer handling unit, and a powerful deposition scheduling and control software. The plasma processing chamber in TY 250 is designed with two separate and distinct zones that allow for high temperature processing and deposition of fine metal layers. The independent zones permit simultaneous metal silicide deposition via remote plasma etching for the production of high-k dielectric materials. The machine has been designed with high sensitivity and a wide range of parameters to minimize defects and enable faster process development. The tool also allows fast powders removal, which minimizes out-of-spec rejects and improves production yields. The in-situ wafer cleaning station in HEKEDA TY 250 is equipped with an advanced pre-cleaning asset to ensure the most effective particle removal before metallization. The station is designed with a programmable rotating spray head and an integrated high-speed drying model for the most uniform and efficient cleaning of ultra-thin wafers. TY 250 transport/in-process wafer handling equipment is fully automated and equipped with advanced vacuum and pressure sensing technologies. The system includes a dedicated robotic wafer handling tool, wafer cooling unit, variable speed belt feed, wafer extraction device, and multiple safety sensors. This ensures a safe, accurate, and reliable transfer and handling of wafers between the plasma processing chamber, the in-situ wafer cleaning station, and the drying oven. HEKEDA TY 250 also features a powerful deposition scheduling and control software. This software allows users to control all process parameters including temperature, pressure, safety, and cleaning cycles. Users can easily set multiple jobs, prioritize them, and monitor all the progress and parameters remotely. The unit also integrates with standard enterprise-level processes control systems for easy integration and automation. TY 250 is an advanced and reliable wafer processing machine designed for metallization processes in semiconductor device manufacturing. It combines high-performance, automated modules with a powerful software, making it an ideal solution for producing high-k materials with improved productivity.