Used HOE IE ELECTRONIC Y06150A #9170754 for sale

HOE IE ELECTRONIC Y06150A is an other wafer processing equipment designed to provide high yield and high efficiency wafer processing. It is designed to be used in the semiconductor industry to perform wafer etching and transfer processes necessary for the production of logic devices. This is accomplished using a combination of high-energy electron (HEE) beam and high-energy ion (HEI) beam technology. Y06150A system operates using a single wafer feed for each of its four main processes: wafer etching, wafer transferring, wafer device fabrication and metal depositing. The process begins with the thermal isolation of the wafer. The thermal isolation unit is then used to protect the wafer from any damage that could be caused by the HEE and HEI beams used in the etching and deposition processes. After the wafer has been thermally isolated, the etching and deposition processes are then initiated. The HEE and HEI beams used in the etching and deposition process are composed of energetic electrons and ions, respectively. The energetic electrons penetrate into the wafer's surface and transfer its heat to the semiconductor material. The electrons further desorb material from the surface of the wafer, which are then evaporated out of the chamber through the exhaust port. Similarly, the ion beams generated by the HEI machine bombard the wafer's surface creating a plasma that evaporates desired materials from the wafer. After the desired materials are evaporated, the evaporation process is then completed by an inert gas purge, typically He, that passes through the process chamber to eliminate any loose particles from the wafer's surface. Once the etching and deposition processes are complete, the wafer is then moved to the wafer transfer stage. The wafer transfer tool is used to flip the processed wafer in the chamber and to transport the wafer to the device fabrication station. During the device fabrication stage, photolithographic techniques are used to etch patterns onto the switches or other desired components. Then, a metal layer is deposited on to the surface of the components, which is typically done through e-beam deposition. Following the deposition of the metal layer, the wafer is then transferred to the second thermal isolation station for cooling and the process is complete. In summary, HOE IE ELECTRONIC Y06150A is an other wafer processing asset used in the semiconductor industry for the fabrication of logic devices. It utilizes a combination of HEE and HEI beams for the etching and deposition process and uses a thermal isolation station to prevent any damage to the wafer. It further features a wafer transfer model to flip the wafer and move it through the various process stages and a device fabrication equipment for the photolithographic patterning and deposition of the metal layer. Ultimately, Y06150A provides high yield and high efficiency wafer processing.