Used JCM RC 100 #9103695 for sale

JCM RC 100 is a wafer processing equipment that is used for the fabrication of a wide range of components. This system is capable of handling slurry, plasma, photo or chemical treatments for various sizes and configurations of wafers. It is capable of processing both round and square shaped wafers on the same unit. This machine features a fully automatic transport mechanism which makes it easier to load and unload wafers as well as allows full flexibility of movement. The wafers are transported into a special processing chamber within the tool. Inside the processing chamber, the wafers receive a combination of up to 6 processing steps, including cleaning, polishing, etching, and plating. The asset also contains a four-position oscillator assembly to further control the processing of the wafers. This oscillator assembly is able to oscillate from point-to-point at 60 positions per minute with a maximum angular range of 8.5°. Other features of RC 100 model include a micro-processor controlled diffuser to ensure uniform processing of the wafers, as well as multiple process control units to allow precise control of the entire process. The equipment's rotating carrier further helps to ensure uniform wafer processing. This rotating carrier holds up to 8 wafers at a time and rotates up to 2000 RPM. It also has adjustable height settings to accommodate different wafer sizes and to allow for uniform processing throughout each batch of wafers. The system also contains an internal temperature control unit, enabling the operator to set temperature limits for each different process step. JCM RC 100 machine has multiple safety systems in place to ensure the safety of the operator and the quality of the wafers. This includes a pressure monitoring tool, an exhaust asset for controlling airborne particles, as well as overflow protection to avoid potential hazardous material spills. All in all, RC 100 is an advanced, automated wafer processing model that offers a high level of flexibility, precision, and safety. It is capable of handling slurry, plasma, photo or chemical treatments for different sizes and configurations of wafers, in addition to featuring a fully automatic transport mechanism and an adjustable rotating carrier. By utilizing the multiple process control units and safety systems in place, operators can be sure of consistent and high-quality results every time.