Used KLEIBER & SCHULZ INC FSW43 #9128261 for sale

KLEIBER & SCHULZ INC FSW43 is a wafer processing equipment designed for precision processing of semiconductor wafers and other advanced materials. This system is suitable for any wafer size between 50 and 200 mm and can be used to process advanced materials up to a total wafer thickness of about 1 mm. FSW43 is capable of depositing thin films and patterning these films with great precision, using a variety of semiconductor wafer fabrication techniques. This unit employs a stepper splitting mechanism and an advanced stepping machine to ensure accurate step and repeat exposures for each layer. The tool also has built-in temperature control capabilities which are regularly monitored and adjusted during the processing cycle. KLEIBER & SCHULZ INC FSW43 integrates a variety of wafer processing capabilities, including: spin coating, exposure processing, edge exclusion, shadow masking, liftoff, evaporation and sputtering. Each of these processes can be used in combination to achieve high quality and uniform thin films which can be used for a variety of semiconductor applications. In addition to the automated wafer processing functions, FSW43 provides a number of other important features, such as: a high-resolution vision asset to ensure accurate patterning of each wafer; an auto trimming model to facilitate self-hedging and homogenous pattern positioning; and an optional vision equipment for full 3D imaging of wafer surfaces during the processing cycle. KLEIBER & SCHULZ INC FSW43 also provides an impressive range of performance and safety features, such as: a vacuum system for optimal substrate to wafer processing; automatic emergency shut-down; as well as numerous other safety and protection systems to ensure full compliance with all required safety standards. FSW43 is an advanced and reliable wafer processing unit that offers unparalleled levels of performance and dependability. It is the ideal choice for users who require accurate thin film deposition and patterning of delicate wafers and other advanced materials.