Used KOLB PS07 ST #293642590 for sale

Manufacturer
KOLB
Model
PS07 ST
ID: 293642590
Vintage: 2006
Stencil cleaner Ambient temperature: 20°C / 50°C Noise: ≤74 dB Contents cleaning tank: 75 L (Approx) Contents rinse water tank: 75 L (Approx) Fine filtration: ≤10 µ Candle filters and bottom fleeces Connection water supply: 3/8" Hose connection, 14 mm Connection rinse water drain: 3/4" Hose connection, 25 mm Exhaust connection: Φ160 mm > 200 to 300 m³/hour Power supply: 400 VAC, 16 A, 3-Phase, 50/60 Hz Power consumption: 4.2 - 9 kW 2006 vintage.
KOLB PS07 ST is an advanced stand alone wafer processing equipment, designed for the semiconductor industry. This system is used for a wide range of applications, including wafer cleaning and coating, processing alignment and lithography, wet chemical etching and dry film deposition. The main component of this unit is the vacuum work chamber, which is sealed to maintain the optimal pressure and environment for each step. This work chamber is made of stainless steel, providing a high level of corrosion resistance and cleanliness. The processing station contains the necessary equipment for wafer processing like wafer boats, which hold the wafers in place during baking, photoresist coat, exposure and development steps. The wafers can be heated by either a furnace or hot plate. The exposure and development cycle is controlled by a fully automated process unit. The robot arm is used to accurately move the wafers from one processing station to the next and is able to do so with high accuracy and repeatability. The machine also includes a variety of standard sensors and instrumentation for process monitoring, including an integrated vision tool for accurate sample alignment during each step. The vision asset is backed up by optical sensors that detect the exact coordinates of the wafers on the wafer boats and without any human intervention. KOLB PS 07 ST is easy to maintain and provides a very precise, reliable and repeatable performance. The model can be used for a variety of wafer processing applications, including thick and thin film deposition, sputtering, photolithography and wafer bonding. This equipment is especially suited for volume production of high-precision components, ensuring complete batch consistency and quality control.
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