Used KYORITSU SEIKI GV1-20HAT-PF #293663639 for sale

ID: 293663639
System.
KYORITSU SEIKI GV1-20HAT-PF is a high-temperature wafer processing equipment used in semiconductor manufacturing. This system uses advanced wafer-level processing technologies to form oxide patterns quickly and accurately without damaging the underlying material. GV1-20HAT-PF uses high-temperature deposition methods to coat the wafers with a thin layer of materials such as silicon dioxide or polysilicon. This is done in a high-temperature furnace, where the substrate is heated to temperatures upwards of 850°C. This ensures that the thin film will coat the wafers evenly and create an oxide pattern that is consistent throughout the entire substrate. Once the oxide pattern has been formed, KYORITSU SEIKI GV1-20HAT-PF uses laser optical lithography to project images of the desired pattern onto the substrate. This is done with high precision to ensure precise alignment of the features on the wafer. Another advantage of GV1-20HAT-PF is its low thermal budget. This unit uses a low-temperature, short time-based process. This minimizes the thermal erosion of the underlying material, which can reduce the yield of the final product. Additionally, the low thermal budget results in less stress on the wafer, maintaining its integrity and high performance after processing. KYORITSU SEIKI GV1-20HAT-PF is also highly efficient, as it allows wafer throughputs up to 10 wafers per cycle. This makes it an ideal choice for high-volume production. Finally, GV1-20HAT-PF is equipped with a comprehensive suite of safety features. This includes a temperature sensor that prevents the machine from overheating, and a pressure sensor that monitors the chamber pressure to ensure that it does not exceed the allowable limits. In summary, KYORITSU SEIKI GV1-20HAT-PF is a high-temperature wafer processing tool that uses advanced wafer-level processing technologies to form oxide patterns quickly and accurately without damaging the underlying material. This asset offers a low thermal budget, high throughputs, and comprehensive safety features, making it an ideal choice for semiconductor manufacturing applications.
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