Used NORTHLAB ACC-01-0100 #9301570 for sale

NORTHLAB ACC-01-0100 is a sophisticated other wafer processing equipment. It is designed to provide high-end wafer-level Packaging Solutions. The system is capable of inline Ultrasonic wire bonding, Automated Optical Inspection and in-line Reflow soldering enabling high throughput on 200mm - 300mm wafers. The accuracy and speed of ACC-01-0100 is enhanced by its advanced capabilities such as: advanced wire bonder with automated wire length detection, Automatic Wire Alignment (AWA), Automated Optical Inspection (AOI), Inline Reflow soldering and in-situ Vacuum Heat Treatment. The unit includes an advanced Closed-Loop handle metrology and an optional Closed-Loop Inspection Machines which provides high accuracy measurement of die dimensions and heights to ensure optimal wire bonding performance. NORTHLAB ACC-01-0100 is based on a modular design that ensures maximum scalability. The machine utilizes a powerful 3-axis conveyor capable of carrying up to 200mm-300mm wafers at 25 m/min without the need for manual intervention or transfer. It also has several variable options such as wafer orientation, vacuum cleaning, wafer inspection, peripheral processes and wafer exchange functions. All of these allow for better processing flexibility. The tool offers several advantages, such as drastically reduced production costs, improved yield rates, and a high degree of process reliability. It is a cost-effective solution for achieving high quality wafer packing processes in automated production lines. In addition to its low cost, ACC-01-0100 is user-friendly and easy to use. It is equipped with a high level of asset control and fault detection, allowing users to accurately monitor and control the model. In summary, NORTHLAB ACC-01-0100 is the perfect automation solution for producing high-quality electronic components and assemblies. Its modular design, precision accuracy, and high levels of reliability allows users to achieve maximum performance and cost-efficiency.