Used OPTIMAL TECHNOLOGIES USC 60 #9361102 for sale

OPTIMAL TECHNOLOGIES USC 60 is a state-of-the-art wafer processing equipment designed to make automated and highly accurate processing of wafers possible. With its advanced on-board technology, USC 60 can handle a wide variety of wafer sizes, thicknesses, and types of substrates. OPTIMAL TECHNOLOGIES USC 60 is designed to provide automated and accurate processing of wafers of up to 8" in diameter and up to 24" in length. It supports processing of wafers at a minimum thickness of 25-200um in both semi-standard and non-standardized substrates. The system is also capable of etching, patterning, and cleaning wafers without the need for external equipment or manual intervention. USC 60 features an integrated vision unit with advanced optical and image processing capabilities that allows the machine to inspect wafers accurately and reliably. It also features a CCD (Charge Coupled Device) camera and a High Density Adaptive Alignment tool to properly align the wafer and ensure processing accuracy even when the substrate is irregular. The asset's automated wafer handling model is designed to move wafers efficiently and accurately according to predefined parameters. This helps to reduce labor costs and improve overall production yield. OPTIMAL TECHNOLOGIES USC 60 features a central control unit (CCU) that works in tandem with the unit's main board to provide the proper control and monitoring of the equipment. This includes advanced monitoring of the system's operating parameters such as power, temperature, pressure, and time. It also includes a built-in recipe control program that can quickly change the settings of the unit and store multiple process recipes for future use. USC 60 machine runs on a Windows-based tool software that allows the user to easily manage the asset and program the necessary commands for the automation process. This includes configuration of the camera, setup of the wafer handling model, as well as the layout of the process recipes. OPTIMAL TECHNOLOGIES USC 60 equipment also includes an optional Data Acquisition and Analysis Software Package. This software can be used to save and record the processing data of every wafer handled by the system for later analysis. This feature can help in the optimization of the processing parameters of a given process, leading to higher yield and reduced overall risks.