Used PIO USC-30SR #9300548 for sale

PIO USC-30SR is a wafer processing equipment designed to quickly and reliably prepare thick wafers for various types of high-end applications. This system is based on the dual-mechanical design of both a superior pressure processing unit and a vacuum processing machine. The pressure processing tool is equipped with a large array of powerful chambers that apply up to 4,000 psi of pressure to the wafer. This pressure is applied evenly over the entire surface of the wafer, allowing for precise control and isolation of targets. The pressure also allows for a higher degree of throughput. The wafer is secured in place on a removable pressure stage with enclosed clamps that can be precisely regulated for both the pressure delivery and the desired wafer size. The vacuum processing asset utilizes an ultra-precise vacuum process to extract unwanted particles and other imperfections from the wafer. The model is equipped with internally cooled components that allow the wafer to be exposed to different types of vacuum temperatures. This precision vacuuming helps to ensure that all contaminants from the wafer are removed prior to further processing. The entire equipment is designed with safety and reliability in mind, with a series of redundant safeties and circuit breakers in place to protect the user and the machine. The system also has a variety of digital monitors and visual indicators in place to facilitate efficient maintenance checks and monitoring of the status of the unit. USC-30SR is a powerful and reliable tool for quickly and accurately producing wafer products. With its dual processing machine, the tool offers precision pressure processing and superior vacuum extraction and cleaning. This asset is designed to be user friendly, with safety and reliability built-in. Finally, the model is constructed with components of the highest quality, allowing it to handle extreme levels of pressure and temperature with ease.