Used SCHLEUNIGER TM66 #9036128 for sale

SCHLEUNIGER TM66 is an automated wafer processing equipment that offers fast, high precision and reliable wafer cutting, dicing, and slicing. SCHLEUNIGER TM 66 is capable of processing both 300mm and 200mm wafers. It has the flexibility to adjust to both thicknesses, as well as to varying substrate types. The result is a precise, accurate cut that meets the highest quality standards. TM-66 is composed of two components that work together to produce the highest quality cuts. The first component is the Process Control Unit (PCU), which allows users to control the cutting parameters from a touch screen. This unit is equipped with a graphical user interface (GUI) that can be programmed to accommodate different wafer thicknesses and substrate types. The second component is the Processing Unit (PU) where the actual cutting occurs. The PU features a high-speed diamond blade powered by a servo motor that is capable of cutting at speeds of up to 500 cuts/min. The cutting blade is also adjustable to accommodate different substrate thicknesses. TM66 is designed to provide precise, accurate cutting results. It is equipped with a measurement system that provides real-time feedback on the thickness of the wafer as the cutting takes place. This unit ensures that the blade is cutting to the specified thickness tolerance. Additionally, TM 66 includes anti-static measures to ensure that there is no electrostatic discharge during the cutting process. SCHLEUNIGER TM-66 also features a user-friendly error detection machine that informs the user of any abnormal conditions that may occur during the cutting process. This tool is designed to stop the cutting blade immediately in the event of an anomaly. This ensures that there is no damage to the wafers caused by cutting errors. SCHLEUNIGER TM66 is designed to reduce costs and maximize productivity. With its high quality cutting results and reliable operation, SCHLEUNIGER TM 66 is the ideal solution for precision wafer processing.