Used SHARP ULTRA SONIC #9164772 for sale

SHARP ULTRA SONIC is an advanced ULTRA SONIC wafer processing equipment designed for increased precision and efficient wafer manipulation. The system consists of three main components: a high-power SHARP ULTRA SONIC horn, a focused transmit/receive array, and a high-speed stepping engine. ULTRA SONIC horn produces and directs sound waves to slices of wafer material for highly precise manipulation. The transmit/receive array focuses and amplifies the sound waves for efficient wafer cutting and manipulation. Finally, the high-speed stepping engine sequences through the slicing instructions for precise and intricate operations. Using this unit, wafer production lines can be automated, ensuring high-quality and repeatable results. The machine is capable of producing slices with a thicknesses as small as 0.2mm and with a high degree of precision. It can also perform more complex cuts, such as notches, slots, and rectangles. Additionally, the tool can uniformly cut every slice of the wafer, ensuring consistent quality throughout the entire production run. In addition to precise wafer slicing, the asset can also perform other wafer processing operations, such as lamination and polishing. Additionally, it can manage a wide range of substrates and materials, including silicon, germanium, quartz, gallium arsenide, and other proprietary materials. The model is powered by a software suite, which provides a user-friendly interface and features such as computer-aided programming, real-time diagrams, data logging, and self-diagnostics. It also has safety mechanisms, including sensors that detect foreign objects and prevent damage to machinery and personnel. To increase the equipment's longevity, it has an automatic tool changer and a filter system that blocks out potentially harmful dust and particles. The unit offers a wide range of customization options, making it suitable for many different types of wafer production lines. It can also be used in various industries, including electronics, biotechnology, and automotive. Overall, SHARP ULTRA SONIC is an advanced ULTRA SONIC wafer processing machine that offers versatile and precise wafer manipulation. It can be tailored for a variety of applications and industries, ensuring reliable results and a long lifespan.