Used SHARP UT-304F #9253423 for sale

SHARP UT-304F is an advanced wafer processing equipment providing automated wafer handling, thin-film deposition, and etching capabilities for semiconductor processing. It is designed to accommodate up to 200mm wafers with a handling capacity of 6 wafers at a time. The system has a simple, user-friendly design, providing a cleanroom-compatible, automated wafer transfer unit with easy access for maintenance. The machine provides a number of integrated functions, including vacuum preparation, film deposition, etching, and overall control of wafer temperature. The tool features a full range of advanced control options, from manual to automated operation. With its integrated vacuum asset, UT-304F provides low-temperature film deposition using Reactive Ion Etching or Offset Etching. It is able to etch wafers efficiently and accurately, and allows the user to select specific etching parameters. The model also includes a built-in gas distribution equipment and an integrated safety system. The gas distribution unit ensures that safe levels of gases are delivered to the process chamber throughout the wafer processing cycle. The safety machine is designed to ensure that all gases are vented to the atmosphere as needed and the process chamber is vented safely to eliminate any hazards. In addition, the tool is designed to accommodate both single-side and double-side wafer processing. Through its in-situ optical measurements, SHARP UT-304F can accurately control and monitor the thickness of films deposited during the processing cycle. It also provides advanced real-time monitoring of the process parameters, including pressure, temperature, gas flow, and plasma etch power. As well, UT-304F offers an easy-to-use graphical user interface. This provides access to all asset settings and process data, allowing for optimal control of the model. Through its network interface functions, the equipment also provides efficient remote access, enabling users to monitor and control the system from any networked location. Overall, SHARP UT-304F is an advanced wafer processing unit providing automated wafer handling, RF plasma etching and thin-film deposition capabilities. With its integrated safety, monitoring, and control functions, the machine offers a convenient and efficient wafer processing solution.