Used SHIBAURA HCIII W-LS #9383302 for sale

SHIBAURA HCIII W-LS is a premier wafer processing equipment designed to offer maximum productivity and operating efficiency. It offers an integrated platform of up to eight single-axis and two multi-axis robots, as well as advanced mass throughput capabilities. With a motion control sampling rate of up to 500kHz and a high-resolution wrench feedback system, HCIII W-LS is capable of providing highly accurate and repeatable operations. It is equipped with an advanced, flexible and scalable laser processing platform capable of handling a variety of parts and substrates. The unit utilizes high-power CO2, YAG and Fiber lasers to selectively process wafers ranging from 0.3mm to 200mm in size. The machine's integrated vision capabilities allow for easy and accurate placement of parts and substrates. The laser processing head can be moved in both X and Y axes, allowing for accurate alignment and intensive processing. The tool also features remote monitoring capabilities and multi-channel support with up to five Ethernet ports for improved performance and scalability. It is fitted with Ethernet/IP and PROFINET IO interfaces, a muticore PC, and a web-enabled HMI. The integrated automation software, SILOGINK, makes it easier to control, manage, monitor and maintain the asset, while the integrated WINNC software is designed to provide the operator with comprehensive diagnostics and control tools. The model also delivers an unprecedented level of precision, with its high accuracy, repeatability and performance all maintained by the advanced servo and feedback systems. It also features an intelligent indexing and handling equipment which allows for quick indexing of parts, reducing the total cycle time. The system additionally features quick-changeover capability, allowing for easy and efficient handling of different substrates. With its advanced quality control capabilities, SHIBAURA HCIII W-LS is one of the most reliable and efficient wafer processing systems available.