Used SHIBAURA / TOKUDA KP7500BG #9386801 for sale

SHIBAURA / TOKUDA KP7500BG
ID: 9386801
System.
SHIBAURA / TOKUDA KP7500BG is a highly advanced, precision wafer processing equipment for semiconductor and electronic device packaging. It is designed to provide precision processing of a variety of substrate types, including those used in high-speed memory and logic devices, LCD displays, GaAs devices, and CMOS integrated circuits. The system is optimized for throughput, with an ability to process wafers as quickly as 70mm/sec, while maintaining the tightest allowable tolerances on the dimensions of the substrate. TOKUDA KP7500BG has a variety of features that make it ideal for high-precision processing. It has a precision drive unit with synchronized input and output, which allows it to process wafers in an exact and precise manner. The machine utilizes a spindle motor for accurate and repeatable results. It also has advanced vibration monitoring and control that helps ensure smooth and consistent operation over extended periods of usage. The tool includes a series of removable wafer carriers, allowing it to be quickly and easily reconfigured while also providing a secure environment for the wafers being processed. It has a built-in vision asset that enables rapid determination of the wafer's orientation for proper alignment and processing. In addition, the model can be programmed to automatically monitor and adjust its accuracy over time. The equipment also has an abundant array of communication ports to facilitate efficient interaction with other components of a larger manufacturing network. It has an RS-232 port, a 10/100Base-T port, a USB 2.0 port, and a variety of digital I/O ports for connecting to other systems. To ensure that the system always runs optimally, it has a user-friendly graphical user interface and numerous unit parameters that can be adjusted to fine-tune performance. Overall, SHIBAURA KP7500BG is an impressive, hi-tech wafer processing machine that is ideal for creating complex and precise semiconductor components and electronic device packaging. The tool has an array of features and capabilities that make it well-suited for use in demanding, high-precision applications. It is optimally designed to provide fast throughput and accuracy while ensuring the safety and security of the wafers being processed.
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