Used TAESUNG TSG-SE-250 #9233642 for sale

TAESUNG TSG-SE-250 is a highly efficient and accurate other wafer processing equipment designed for applications such as Dicing, Grinding, Wafer Bonding, and other substrates and surfaces such as silicon. The system supports a variety of substrates and wafer sizes ranging from 8" to 12". It is comprised of a main unit, a robotic wafer handing unit, and a conveyor machine. The main unit is equipped with a high-precision motion control platform which allows motion control based on real-time feedback. It provides a high degree of accuracy and repeatability, allowing the automatic control of machining processes such as wafer grinding, cutting, and bonding. It is equipped with a chiller unit to regulate the temperature and ensure that the tool operates at the ideal temperatures due to the high viscosity produced when processing. The robotic wafer handling asset is designed to quickly and accurately place wafers into the model for processing. The equipment is also capable of separating and separating wafers into trays. The robot is equipped with a 6-axis controller which allows for precise control and accurate wafer alignment. The system is capable of handling slow, as well as fast wafer motions and can be programmed to process specific patterns such as parallel lines and grids. The conveyor unit moves wafers to all the operations required for processing. The machine is equipped with a 3-axial conveyor which provides high speed and accuracy. It is designed to move wafers in a continuous stream without causing damage to the delicate surfaces of the wafer. The tool is also equipped with a reject box to collect any wafers with defects and to separate them from the main process stream. Overall, TSG-SE-250 is a high-performance other wafer processing asset that is ideal for applications such as Dicing, Grinding, Wafer Bonding, and other substrates and surfaces such as silicon. It provides a high degree of accuracy and repeatability due to the precision motion control platform and high-speed conveyor model, as well as a robotic wafer handling equipment for increased efficiency.