Used TAKANG VMC 760 #149977 for sale

ID: 149977
Vertical machining center Fanuc O M control Not currently operational.
TAKANG VMC 760 is a multi-function wafer processing equipment designed to help facilitate the production of high-quality wafers. This system is capable of performing a variety of operations, including spin-coating, dipping, etching, photolithography, and spin-drying, all in one machine. Additionally, VMC 760 includes a robotic arm that can be used to automatically transfer wafers between stages of the process and between individual tools specific to the operation at hand. Due to the automated nature of the robotic arm, TAKANG VMC 760 can quickly and accurately control the movement of up to 200mm (8 inch) wafers, which can be used for a variety of operations. In addition, VMC 760 is also equipped with a powerful etching unit, complete with two mega-etching systems, enabling the etching of both type III or type IV resist layers. TAKANG VMC 760 also comes with simulation software, which helps the user to accurately adjust and adjust parameters such as pressure, concentration, and flow rate, ensuring the highest quality results. The machine also comes with optoelectronics for monitoring the temperature and velocity of the wafer during the etching process, helping to ensure that the results are consistent each time. Additionally, there is also a multi-layer aligner for ensuring proper alignment of up to twelve layers of wafer, meaning that the wafer is processed correctly, regardless of its complexity. Outside of the etching process, VMC 760 enables the user to perform spin-coating, photolithography, and spin-drying. The spin-coating process uses a precision lubricating nozzle to apply a thin layer of material onto the wafer, afterwards turning the wafer to an exact speed so that the material is evenly distributed. Similarly, the photolithography option is used to create fine features on the wafer surface by using UV light, oxide film, and other materials. Lastly, the spin drying process removes any moisture that is present on the wafer after the various operations have been completed. In sum, TAKANG VMC 760 is a powerful wafer processing tool, complete with robotic arm, simulation software, optoelectronics, and multi-layer aligner. These functions make this machine ideal for the production of high-quality wafers, reduce production time, and help ensure that the results are consistent each time.
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