Used TEC MAIN4-R #293659488 for sale

TEC MAIN4-R is a high-precision, high-performance wafer processing equipment designed to process substrates up to 200mm diameter. It provides a fully automated process that includes a series of state-of-the-art technologies, such as edge excising, vacuum degassing and surface cleaning. The system's unique vacuum chamber, low-profile vacuum ring and four-part cold trap configuration deliver superior degree of vacuum (10-6 torr) environment, which is necessary for optimal processing of substrates. The unit's advanced capabilities make it ideal for a variety of wafer processing applications including: dicing of Silicon, Silicon-on-glass, polymer-based and thin film substrates; lithography; etching; and more. It is capable of performing highly precise, repeatable and low-defect driven processes from the edge to the core. The chamber operates under the maintenance of precision temperature baking and de-tempering systems to maintain optimal safety. An optional wet/dry clean machine is available to ensure high-efficiency particle removal. The tool's enclosed robot chamber is designed for maximum process safety, fast exchange of wafer batches and easy maintenance. The automotive-grade controls allow for smooth operation, while the real-time on-board monitoring and control systems provide the highest accuracy and safety standards. With fully automated wafer management and powerful management software, MAIN4-R is capable of performing continuous, high-velocity processing runs 24/7. The asset's robust capabilities are complemented by its user-friendly graphical user interface, which provides an intuitive and powerful platform for remote monitoring and control. User-defined parameters ensure high-quality results, while the powerful performance evaluation software allows for efficient monitoring and multitasking. Backed by TEC world-class support and service, TEC MAIN4-R is the ideal solution for any wafer processing requirements. It is reliable, robust and provides the highest levels of accuracy for a range of wafer processes.