Used TEXSONIC UWM 750X #9219322 for sale

TEXSONIC UWM 750X is a revolutionary wafer processing equipment that offers the highest level of automation and scalability for processing 300mm and 200mm wafers. The system utilizes a patented Ultra-Wideband Modulated (UWM) laser unit with a 750X magnification factor to provide ultra-precise control of particle damage during dicing, singulation, back grinding, and bonding processes. This cutting-edge technology allows users to easily adjust the processing speed and power to accommodate various wafer sizes and thicknesses, as well as to maximize the uniformity of the particle damage at the edge of the wafer. The machine also features advanced monitoring and tracking capabilities, including the ability to deliver wafer-level edge-inspect data for instant analysis. In addition to providing ultra-precision control, UWM 750X tool applies a novel wafer-level passivation techniquethat protects the wafer from contaminants and further minimizes the amount of particle damage during the processing cycle. This asset also features sophisticated motion control systems, which allow users to quickly adjust the cutting speed and depth for various wafer sizes. The design also uses integrated force sensors to provide precise control of the cutting pressure, ensuring the uniformity of the particle damage along the edges of the wafer. With its advanced technologies, TEXSONIC UWM 750X model offers an unprecedented level of scalability for users, allowing them to process large wafers in a wide range of thicknesses and sizes. This equipment also features a variety of safety mechanisms, including an automated beam-stop system, which prevents damage to the wafer material if the beam is inadvertently left on. By combining extraordinary performance, scalability, and reliability, UWM 750X unit is the perfect solution for high-quality cutting and processing of a wide variety of wafers.