Used ULTRASONIC POWER CORP BT90H #9073859 for sale

ULTRASONIC POWER CORP BT90H is an advanced wafer processing equipment that utilizes ultrasonic ultrasound technology to achieve better results than traditional substrate processing techniques. BT90H is primarily used for patterning, etching, and editing of various substrates including SiO2, silicon nitride and polyimides. The system combines several process elements in order to provide reliable, high-quality results. ULTRASONIC POWER CORP BT90H is based on an industrial-grade ultrasonic unit that produces a sequence of high-power ultrasound waves. It also includes a powerful raster scan machine to ensure efficient and accurate patterning. The ultrasound waves generated by the tool help improve performance, as they facilitate faster substrate surface clearance and reduced processing times. BT90H also includes a texturing engine that allows operators to customize and tailor the patterning of the wafer. By using this asset, operators can achieve high-yield patterning with improved feature resolution. ULTRASONIC POWER CORP BT90H includes an integrated software suite that provides a complete analysis of substrate surface modifications in order to verify its quality before and after processing. BT90H is a complete, automated model that requires very little manual intervention from the operator. It includes a user-friendly touch-screen interface with multiple preset options that allow operators to quickly and accurately choose the right settings for each process. The equipment is equipped with both local and remote control, allowing it to be monitored and controlled from a variety of locations. In addition, ULTRASONIC POWER CORP BT90H can be integrated with other industrial systems such as automatic inspection systems, controlling robots and other systems to enhance its performance. The system also has a user-friendly configuration page, which allows operators to fine-tune the performance of the unit based on their specific requirements. BT90H offers an efficient, efficient and accurate wafer processing machine. The combination of various features such as ultrasonic waves, raster scans, texturing engine and automated features result in improved feature resolution and faster substrate surface clearance. Additionally, its user-friendly touch-screen interface and configurable features make it ideal for a wide range of high-end wafer processing applications.