Used ULTRASONIC UFB-3-1A #9290437 for sale

ULTRASONIC UFB-3-1A Wafer Processing Equipment is a powerful solution for automated wafer processing. This machine combines ULTRASONIC and laser technologies to automate a wide array of wafer-level operations. The system is designed for cleanroom use and is suitable for both repetitive and non-repetitive wafer substrate enhancements. UFB-3-1A unit includes a high-performance Spindle-Y1 ULTRASONIC tool, which provides precise and rigid motorized motion for progressive cutting, ablation, polishing, and etching. It is capable of handling wafer sizes up to 150mm in diameter and up to 8mm in thickness. The Spindle-Y1 incorporates a unique design that allows it to accurately cut and drill wafers at high levels of precision and repeatability. Additionally, it is compatible with a range of wafer materials, including silicon, metal, polyamide, and PCBs. The machine also features a high-performance X-Y linear stage, with a rigid platform and precise motorized motion control. This powerful stage enables ULTRASONIC UFB-3-1A to easily and accurately traverse the entire wafer surface. The tool is also outfitted with a three-axis vision asset, which provides advanced pattern recognition capabilities for efficient alignment of wafers prior to processing, as well as ultra-high accuracy inspection and defect correction. UFB-3-1A also offers high-quality laser technology, including a wavelength-specified beam generator, which can be used to engrave the surface of wafers with high-resolution images. This laser model is capable of micrometer and nanometer level patterning and engraving. Additionally, the equipment is equipped with a manual mechanical edge profiling tool, which can be used to accurately trim wafers and improve deburring times. ULTRASONIC UFB-3-1A system is suitable for both complex and conventional wafer processing operations. With its user-friendly interface, this unit is suitable for various levels of user expertise. Its intuitive graphical user interface gives easy access to tools and settings, providing quick start-up and operation. With its wide range of integrated technologies, UFB-3-1A offers an automated and cost-effective solution for wafer processing.