Used VIRTIS Virsonic 50 #9374832 for sale

VIRTIS Virsonic 50 is an advanced wafer processing equipment designed for high throughput applications in the semiconductor industry. It has a modular system design and can handle wafer sizes ranging from 200 mm to 300 mm. It has a number of features that make it suitable for a variety of processes such as over-etching, patterning, and chemical-mechanical planarization (CMP). Virsonic 50's high throughput, coupled with its process flexibility, makes it particularly useful in processes that require a high degree of accuracy and reproducibility. The unit includes a fully automatic loading and unloading station, which allows for uninterrupted processing even when working with multiple wafers. The wafer cassette and gantry-based loading/unloading systems ensure that the wafers are always handled with utmost care. VIRTIS Virsonic 50 machine incorporates four process/etching chambers, each of which has its own programmable process parameters. Each chamber has a specific function, from plasma etching to wet etching, and can be programmed to execute multiple parameters in any combination. The tool also includes a central process controller, allowing users to monitor and adjust process parameters easily and efficiently with a graphical user interface. The asset also includes a fully automated wafer probing station, which enables users to automatically detect edge issues, process defects and other wafer problems that are not easily visible to the naked eye. This ensures that wafers are consistently processed with optimal accuracy. The model also features an optional nitride technique, which can be used to increase the selective etching times as well as enhance the uniformity of the etching process. Virsonic 50 is designed for maximum flexibility and productivity. It is reliable and durable, and requires minimal maintenance to keep it running at optimal levels. Its modular design offers a degree of scalability, making it suitable for a variety of wafer-processing applications. Its integration with robotic wafer handling makes it a great choice for high throughput applications, ensuring that every wafer is processed to exact specifications with minimal manual intervention.