Used VITRONICS SOLTEC XPM2 520 #9240996 for sale

ID: 9240996
Vintage: 2006
Reflow oven 2006 vintage.
VITRONICS SOLTEC XPM2 520 is a high-performance oven/furnace that is perfect for a wide variety of reflow processes. It offers excellent temperature uniformity, highly efficient heat transfer capabilities, and reliable control parameters for precise reflow in tight production environments. VITRONICS SOLTEC XPM2-520 is a professional multi-zone convection reflow tool with 4 independently targetable independent convection zones and a top-mounted preheat zone for very precise reflow control. The top-mounted preheat station ensures uniform assembly heating that is unaffected by fluctuations in air pressure or fluctuating mass flow within the oven chamber. XPM2 520 also features a Rapidization Cycle that eliminates bridging and lead-pulling issues by eliminating the effects of cold solder joints. This feature is unique to the XPM2 and provides consistent lead formation, allowing for a higher quality product that meets the demands of higher density packages such as BGA or CSP. XPM2-520 delivers superior temperature accuracy and uniformity with no possibility of cold or hot streaks. It can reach temperatures up to 400°C, making it perfect for heavy-duty reflow or soldering processes. The control module of VITRONICS SOLTEC XPM2 520 is configurable to the most demanding requirements including steady-state reflow or dynamic thermal cycling. Additionally, the oven is equipped with alarms and a pre-emptive cooling system for enhanced protection against component damage. The XPM2 utilizes a bottom-edge-lift system that is designed to provide a solid platform for uniform convective heat transfer all the way from the component bed. This system ensures reliable and consistent reflow or soldering processes, even in unique application scenarios. The XPM2 is equipped with an RS-232 interface for data logging and connectivity, as well as an optional Ethernet/RS-485 module for remote monitoring and operation. VITRONICS SOLTEC XPM2-520 is an ideal reflow tool for high-density components requiring specialized processing, with the capabilities to satisfy a variety of demanding reflow and soldering requirements. Its reliable temperature control and uniform heat transfer make it a great choice for top-tier production lines. Additionally, with RS-232 and optional Ethernet/RS-485 connectivity for remote monitoring, the XPM2 is an excellent oven/furnace choice for assured quality assurance and set-up from afar.
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